Taipei, March 21 (CNA) Contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) announced Friday that it will hold a 2 nanometer process production expansion ceremony in the southern Taiwan city of Kaohsiung on March 31.
TSMC's 2 nm chips are expected to be mass-produced in Hsinchu in the second half of 2025. At the same time, the company will also establish fabs for multiple stages of the 2 nm chip production process in Kaohsiung.
The ceremony is being held to express gratitude to the company's suppliers and will be hosted by TSMC's Executive Vice President and Co-Chief Operating Officer Y.P. Chyn (秦永沛), the company said.
The 2 nm process is TSMC's first manufacturing process to incorporate the Nanosheet structure, offering a 10-15 percent speed increase at the same power consumption compared to the N3E process, or a 25-30 percent reduction in power consumption at the same speed, while also increasing semiconductor density by more than 15 percent.
Commentators said that following the company's announcement at the start of March that it plans to increase investment in the United States by US$100 billion, the ceremony is being held to showcase its dedication to Taiwan.
