跳到主要內容區塊
僑務電子報
:::

Hsinchu Breaks Ground on Advanced Semiconductor R&D Center

2026-02-11
TaiwanPlus
分享
分享至Facebook 分享至Line 分享至X

 

Taiwan has broken ground on its first government-built 12-inch advanced process pilot line in Hsinchu County, designed to strengthen its global chip competitiveness. The new R&D center will help local companies and startups accelerate product development, support next-generation technologies and reinforce Taiwan’s leadership in the semiconductor supply chain.

相關新聞

top